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Intel claims that it will pack 1 trillion transistors onto a chip by 2030

By ET Bureau - December 05, 2022 1 Mins Read

Intel Corp. researchers have revealed a number of technological innovations and concepts, including packaging improvements that could result in computer chips.

The company claims that its most recent research could enable chips with more than a trillion transistors by 2030, greatly extending the Moore’s Law principle. The performance and efficiency of central processing units are among the areas Intel’s new transistor and packaging research is concentrated on. Additionally, it is considering how to reduce the gap between contemporary chiplet-based designs and conventional single-die processors.

Also Read: Atos establishes AWS Data Lake Accelerator for SAP increasing customers’ business performance and outcomes

The company presented new research at the IEEE International Electron Devices Meeting 2022 that highlighted several processes, materials, and technologies that it intends to use to produce chiplet-based trillion-transistor processors by 2030.

Read More: Intel says it will squeeze 1 trillion transistors onto a chip package by 2030

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