AMD, Intel, TSMC, Microsoft establish universal chiplet standard

AMD_ Intel_ TSMC_ Microsoft establish universal chiplet standard-01

AMD, Advanced Semiconductor Engineer, Arm, Google Cloud, Intel, Meta, Microsoft, Qualcomm, Samsung, and Taiwan Semiconductor Manufacturing Company (TSMC) have formed an alliance to establish a universal chiplet interconnect Express (UCIe) standard.

The Industrial Consortium said the UCIe standard, approved as UCIe 1.0, was designed to assist with “die-to-die” connectivity between hardware, software, and compliance testing. 

They also plan that it will allow end users to “mix and match” chiplet components from multiple vendors with custom System-on-Chip architecture.

Read More: Zdnet

Check Out The New Enterprisetalk Podcast. For more such updates follow us on Google News Enterprisetalk News.

Previous articleGraph Data Platforms to Change the Data Landscape
Next articleFaros AI launches free open source platform